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As smartphones continue to overheat, cooling them effectively remains a challenge. At CES 2026, a startup introduced a novel solution using tiny ultrasonic speakers, allowing components to be cooled quietly and without conventional fans.
Processors are constantly increasing in power, both in computers and mobile devices. At CES 2026, AMD unveiled the Ryzen 9850X3D, touted as the fastest gaming processor in the world. This increase in performance brings a well-known challenge for manufacturers: the faster a component is, the more heat it generates, which can limit its long-term efficiency. Consequently, cooling systems have become as critical as raw power.
Smartphones also face this overheating issue. To prevent overheating, some devices automatically slow down, which diminishes their performance. Enthusiasts sometimes take extreme measures. A modified iPhone 17 Pro Max recently made headlines with an external cooling system borrowed from computers—a practical solution, but not viable for everyday use.
Ultrasonic speakers cool smartphones without the need for fans
At CES 2026, the startup xMEMS showcased a groundbreaking technology named µCooling. This miniature cooling system is based on MEMS speakers. By emitting ultrasonic waves at over 50 kHz, these components can move air within a device silently and without fans. According to the company, a smartphone-specific version could move up to 2.8 liters of air per minute, enough to maintain a stable temperature around sensitive components.
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This technology is already operational in connected devices such as smart glasses. An air flow created in one arm can lower the temperature in a specific area. This concept could be adapted to smartphones through a discreet air channel integrated into the chassis. xMEMS has provided prototypes to several manufacturers. This method could preserve chip power without compromising battery life or adding bulk to devices. An elegant solution that avoids fans and does not turn the phone into a mini refrigerator.
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